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Real-time technical support and development now closer to major electronics customers
March 17, 2010
By: DAVID SAVASTANO
Editor, Ink World Magazine
In light of the skyrocketing growth of the electronics industry in China, DuPont Circuit & Packaging Materials (CPM) opened its new lab in Shanghai, China. Located in the DuPont China R&D Center, the new lab features advanced facilities including equipment designed for testing and evaluating materials and products for use in rigid and flexible printed circuit board (PCB) and wafer level packaging (WLP) applications. This multi-functional lab will enable faster and more efficient ...
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